This fourth edition (FAME IV) continues a series of deep-dive workshops dedicated to exploring the challenges, open questions, and emerging opportunities in epitaxy. A carefully selected group of leading experts – recognized for their outstanding contributions to the scientific community – will deliver invited presentations and share their extensive expertise.
Join us for an in-depth workshop on NanoIC’s fine-pitch redistribution layer (RDL) and die-to-wafer (D2W) hybrid-bonding PDKs, the first open-access interconnect PDKs enabling high-density, energy-efficient chip-to-chip integration. A workshop co-organized by Europractice and the NanoIC pilot line.
Discover how NanoIC’s IGZO‑based eDRAM PDK can accelerate your next‑generation memory designs in a one‑day workshop, co-organized by Europractice and the NanoIC pilot line.
European Materials Research Society Spring Meeting